Hylke B Akkerman - Advanced Printed Manufacturing Techniques for Smart Wearables With Application to Miniature Gas Sensors

At Holst Centre, we have developed a novel multi-material additive manufacturing technology for electronics that surpasses more traditional PCB manufacturing, not only in terms of resolution, but moreover in the possibility of fabricating electronics in complex 3D form factors. The layer-by-layer fabrication of circuitry embedded in a patternable polymer matrix enables miniaturized sensing electronics integrated into objects that are too small or complex to combine with stand alone electronics. In particular for medical instrumentation and wearables, the compact integration provides new opportunities for sensor integration without compromising on the intended main functionality or design. The 3D microelectronics are made by UV-patterning a photosensitive polymer in which components are placed into cavities and empty groove patterns are filled with a conductive paste to realize the circuitry. Here we will present recent developments in this technology and showcase examples where an ultrasound CMUT array for imaging was integrated into the tip of a catheter of only 6 mm in diameter and a wearable patch having a multi-wavelength PPG sensor to measure perfusion and blood oxygenation levels.

Roger Grace - Prologue and Epilogue

The prologue will provide an overview of the topic, printed, flexible, stretchable, and functional fabric sensors, and focus on the unique features and corresponding benefits of these technologies versus other approaches. An overview of the competitive landscape of several organizations that currently have products on the markets embracing these technologies will be provided. Also addressed will be the global landscape of the research and development laboratories and universities that are currently pursuing these technologies. The epilog will provide a review of the high growth application opportunities and a summary of the results of approximately 10 independent research organizations who monitor market values and compound annual growth rates (CAGR) to the year 2030. Also addressed will be the challenges faced by developers to bring their technologies to market as well as recommendations on how to overcome these commercialization challenges and successfully monetize these technologies.

 Rob Podoloff - Innovations and Collaborations with Tactile Sensing

This session explores how advancements in tactile sensing technology are revolutionizing numerous industries. This presentation highlights various cases where high-resolution sensors have enhanced devices, including a diagnostic instrument for interventional medical procedures, a new sensor for measuring temperature distribution during battery charging, and a tactile sensing glove made from a new family of flexible, stretchable materials.  The presentation demonstrates the potential of collaborative development to solve complex challenges, paving the way for improved product performance and patient outcomes.

Janos Veres - Sensor Convergence: Integration of Functionalities Across Scales

Sensor integration is becoming critically important for the Internet of Things (IOT) with unique demands for each application. At the level of semiconductor packaging, Heterogeneous Integration has become an essential trajectory for scaling in terms of complexity and functionality. At the level of circuits and boards, we are beginning to see embedded microfluidics, environmental, and physiological sensors. Sensors are also becoming intertwined on the system level, for example, in automotive panels or aircraft wings. Moreover, scales of integration are converging from silicon to entire systems, resulting in new challenges and new opportunities for innovation. Multi-functional, integrated electromechanical systems are emerging, with examples in medical, wearable, robotics, automotive, and aerospace applications. The presentation will discuss trends and examples of multi-functional integration and their impact on design automation, materials, process technologies, manufacturing, and supply chains. .

Dr. Sreeni Rao and Paul Brook - Advanced Printed Manufacturing Techniques for Smart Wearables With Application to Miniature Gas Sensors

Wearable devices and smart textiles incorporating flexible sensors and electronic circuits are finding increasing application in Consumer, Industrial, and Health/Wellness markets. The underlying technology to accomplish these is the ability to produce highly conductive circuits, sensors of different modalities, and interface components, on a variety of substrates. Our presentation will share an advanced, award-winning printing technology that utilizes specialized conductive inks, often based on silver or carbon, that are printed onto transfer films and subsequently heat-pressed onto textiles or other substrates. Unlike traditional circuit manufacturing, this process offers a cost-effective, low-CapEx, lightweight, and scalable alternative for promoting ubiquitous sensing, while solving the usual limitations related to adhesion, durability, and electrical performance. Via real-life application examples, the presentation will exemplify the nuances and advantages of this unique approach by discussing screen-printed gas sensor technology and the challenges of integrating it into the advanced print process flow described here.